Case-Study Presentations for Industry Sessions
Guidelines for Authors
ETS'22 organizes Industry Sessions aimed to be a technical discussion forum for engineers facing test problems and researching solutions in the real world. Relevant topics are: testing, wafer probing, device handling, test flow, validation, simulation, GR&R, yield, coverage, quality, FuSa. Sessions will be organized in slots of 10' for presentation and 10' for questions & answers.
Authors are invited to submit a 300 word abstract plus 1 page of data/charts. Industry Track Chairs will make the selection of submitted proposals according to the suitability of the topics and the relevance for the ETS'22 audience. Authors are encouraged to use formatting style from IEEE conference standards.
Key Dates for Submission (Midnight, AoE)
January 21st, 2022February 4th, 2022 → Industrial Case-Study abstracts & charts.February 11th, 2022February 25th, 2022 → Notification of acceptance.March 15th, 2022February 29th, 2022 → (optional) Camera-ready manuscript.
Submission Website
All submissions must be made electronically as a single PDF file. Please, access to the submission link and select option "08" at the "Summary Submission" menu.
We appreciate if you can fill the following survey before your submission. Thank you.
Publications
Accepted contributions become part of the Informal Digest of the European Test Week 2022. The informal contributions WILL NOT be sent for indexing by IEEE Xplore. Instead, the Informal Digest will be made available to all ETS attendees in electronic format. Moreover, there will be an optional Open Access publication in the Informal Digest of the European Test Week 2022. Thus, a later, more complete publication of the work in another conference or journal will still be possible.
Contact Information
For more information contact the Industry Track Chairs:
- Wim Dobbelaere, onsemi (B), wim.dobbelaere@onsemi.com
- Hans Manhaeve, Ridgetop Europe (B), hans.manhaeve@ridgetop.eu
- Davide Appello, STMicroelectronics (IT), davide.appello@st.com
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